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Design and Fabrication of Industrial Enclosure Passive Thermal Management with Heat Pipe Technology :A Review

Shruti Redij1,Harish Chinchkar2, Yash Tatugade3, Dr.Usha Pawar4 Prof. Bhavna Ingole5,
Prof. Mrunali Patil6
1Department of Mechanical Engineering & Datta Meghe College of Engineering, Airoli
2Department of Mechanical Engineering & Datta Meghe College of Engineering, Airoli
3Department of Mechanical Engineering & Datta Meghe College of Engineering, Airoli
4Department of Mechanical Engineering & Datta Meghe College of Engineering, Airoli
5Department of Mechanical Engineering & Datta Meghe College of Engineering, Airoli
6Department of Mechanical Engineering & Datta Meghe College of Engineering, Airoli

Abstract - This project focuses on the design and development of a passive therm al management systemfor industrial electrical enclosures using heat pipe technology. Industrial enclosures generate significant internal heat from electronic components while requiring sealed protection from dust, moisture, and contaminants, making conventional cooling methods less effective. To address this challenge, grooved copper heat pipes charged with R134 a refrigerant were integrated into a demonstration enclosure subjected to a 400 W heat load. Analytical comparisons between fin-based cooling and heat pipe-based cooling showed that heat pipes offersignificantly higher effective thermal conductivity and superior heat dissipation capability. The fabricated system also incorporates DC fans for enhanced convection and an loT-based remote temperature monitoring system for real time performance tracking. The results demonstrate that heat pipe technology provides a compact, energy efficient, and sustainable solution for passive cooling of industrial enclosures.
Key Words:Enclosure, Passive Thermal Management, Phase, Conductivity, Closed-Loop,Capillary Action, Axial,Grooved .