International Scientific Journal of Engineering and Management

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ISSN: 2583-6129

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SRAM Memory Cell Design & Stability Analysis

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Published 19 July 2026
Updated 19 July 2026

SRAM Memory Cell Design & Stability Analysis

 

 

Shiva Kumar R 1, Dr.Basavalinga Swamy 2,Prof .Sadhana C 3, Dr. Sharanbasappa Shetkar 4  , Dr.Vinita Patil 5

1Shiva Kumar R Dept. of VLSI Design and Embedded system, M.tech student, LAEC, Bidar

2Dr.Basavalinga Swamy, Associate Professor, Department of ECE, LAEC Bidar

3S Prof .Sadhana C, Assistant Professor, Department of ECE, LAEC Bidar

4Dr.Sharabasappa Shetkar, Professor, Department of ECE, LAEC Bidar

5Dr.Vinita Patil, Professor, Department of ECE, LAEC Bidar

 

 

Abstract - The Static Random Access Memory (SRAM) is one of the most widely used semiconductor memory technologies in modern digital systems due to its high operating speed, low latency, and compatibility with CMOS technology. SRAM plays a significant role in processor cache memories, embedded systems, communication devices, and portable electronic applications where rapid data access and low power consumption are essential. However, continuous scaling of CMOS technology introduces several challenges, including increased leakage current, reduced supply voltage, process variations, and degradation of memory cell stability. These factors directly affect the read, write, and hold operations of SRAM cells, making stability analysis an important aspect of memory design.

This paper presents the design and stability analysis of a conventional CMOS-based SRAM memory cell with emphasis on improving its operational reliability under different operating conditions. The proposed work focuses on the transistor-level implementation of the SRAM cell and evaluates its performance using standard CMOS design principles. The design methodology includes the analysis of read operation, write operation, and data retention (hold state), followed by the evaluation of important stability parameters such as Read Static Noise Margin (RSNM), Write Static Noise Margin (WSNM), and Hold Static Noise Margin (HSNM). The influence of supply voltage, transistor sizing, temperature variation, and process variations on memory stability is also discussed to provide a comprehensive understanding of SRAM performance.

The proposed SRAM design is simulated using an electronic design automation (EDA) environment to verify its functional correctness and analyze important performance metrics, including power consumption, propagation delay, and noise margin. Simulation results demonstrate that the designed SRAM cell achieves reliable read and write functionality while maintaining satisfactory stability and low power operation. The obtained results indicate that appropriate transistor sizing and careful stability optimization significantly improve memory reliability without introducing excessive design complexity.

The presented study provides a practical approach for designing stable and energy-efficient SRAM cells suitable for modern VLSI systems. The proposed methodology can serve as a foundation for future research involving advanced SRAM architectures, technology scaling, and low-power memory design techniques for next-generation computing and embedded applications.

Keywords: Static Random Access Memory (SRAM), CMOS Technology, VLSI Design, Memory Cell, Static Noise Margin (SNM), Read Stability, Write Stability, Hold Stability, Low Power Design, Semiconductor Memory.

 

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